{"id":139529,"date":"2026-06-25T09:46:29","date_gmt":"2026-06-25T07:46:29","guid":{"rendered":"https:\/\/tsep.com\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\/"},"modified":"2026-10-28T16:00:34","modified_gmt":"2026-10-28T14:00:34","slug":"tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology","status":"publish","type":"post","link":"https:\/\/tsep.com\/en\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\/","title":{"rendered":"TSEP in the Trade Press: USBTMC&#8217;s Challenges in Measurement Technology"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"139529\" class=\"elementor elementor-139529 elementor-138196\" data-elementor-post-type=\"post\">\n\t\t\t\t<div class=\"elementor-element elementor-element-6a7915f e-flex e-con-boxed e-con e-parent\" data-id=\"6a7915f\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-892159d elementor-widget elementor-widget-text-editor\" data-id=\"892159d\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>The USB standard is constantly evolving, with<\/strong> faster data transfer and new features such as the USB-C connector. This necessitates modifications to existing USBTMC interface solutions for measuring devices, which entails costs and additional development work. A USBTMC adapter offers a new and effective way to minimize this effort.   <\/p><p><br>The <strong>trade magazine PC&#038;Industrie<\/strong> has published a technical article by our CEO, Peter Plazotta, on this topic:<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-89f215f e-flex e-con-boxed e-con e-parent\" data-id=\"89f215f\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-b94a572 elementor-widget elementor-widget-button\" data-id=\"b94a572\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-button-wrapper\">\n\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-sm\" href=\"https:\/\/webkiosk.epaper-kiosk.beam-verlag.de\/6-2026\/71111747\/92%20\" target=\"_blank\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">Read the full article here (pp. 92\u201393)<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>The USB standard is constantly evolving, with faster data transfer and new features such as the USB-C connector. This necessitates modifications to existing USBTMC interface solutions for measuring devices, which entails costs and additional development work. A USBTMC adapter offers a new and effective way to minimize this effort. The trade magazine PC&#038;Industrie has published [&hellip;]<\/p>\n","protected":false},"author":3,"featured_media":11979,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[1],"tags":[],"class_list":["post-139529","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-unkategorisiert"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.8 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>TSEP in the Trade Press: USBTMC&#039;s Challenges in Measurement Technology - Technical Software Engineering Plazotta GmbH<\/title>\n<meta name=\"description\" content=\"PC&amp;Industrie has published a technical article on the USB standard and the necessary modifications to existing USBTMC interface solutions for measuring instruments.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/tsep.com\/en\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"TSEP in the Trade Press: USBTMC&#039;s Challenges in Measurement Technology - 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Technical Software Engineering Plazotta GmbH\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/tsep.com\\\/en\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/tsep.com\\\/en\\\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/tsep.com\\\/en\\\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/tsep.com\\\/wp-content\\\/uploads\\\/2024\\\/10\\\/TSEP-2024-09-Stills-342_v1-print-e1772448940133.jpg\",\"datePublished\":\"2026-06-25T07:46:29+00:00\",\"dateModified\":\"2026-10-28T14:00:34+00:00\",\"description\":\"PC&Industrie has published a technical article on the USB standard and the necessary modifications to existing USBTMC interface solutions for measuring instruments.\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/tsep.com\\\/en\\\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/tsep.com\\\/en\\\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/tsep.com\\\/en\\\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\\\/#primaryimage\",\"url\":\"https:\\\/\\\/tsep.com\\\/wp-content\\\/uploads\\\/2024\\\/10\\\/TSEP-2024-09-Stills-342_v1-print-e1772448940133.jpg\",\"contentUrl\":\"https:\\\/\\\/tsep.com\\\/wp-content\\\/uploads\\\/2024\\\/10\\\/TSEP-2024-09-Stills-342_v1-print-e1772448940133.jpg\",\"width\":2560,\"height\":1706,\"caption\":\"TSEP Themis\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/tsep.com\\\/en\\\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/tsep.com\\\/en\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"TSEP in the Trade Press: USBTMC&#8217;s Challenges in Measurement Technology\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/tsep.com\\\/en\\\/#website\",\"url\":\"https:\\\/\\\/tsep.com\\\/en\\\/\",\"name\":\"Technical Software Engineering Plazotta GmbH\",\"description\":\"TSEP ist ein weltweites t\u00e4tiges Systemhaus, das sich seit \u00fcber 30 Jahren auf die Entwicklung systemnaher Software spezialisiert hat.\",\"publisher\":{\"@id\":\"https:\\\/\\\/tsep.com\\\/en\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/tsep.com\\\/en\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/tsep.com\\\/en\\\/#organization\",\"name\":\"Technical Software Engineering Plazotta GmbH\",\"url\":\"https:\\\/\\\/tsep.com\\\/en\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/tsep.com\\\/en\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/tsep.com\\\/wp-content\\\/uploads\\\/2023\\\/08\\\/TSEP-Logo_claim_primaer_pos.svg\",\"contentUrl\":\"https:\\\/\\\/tsep.com\\\/wp-content\\\/uploads\\\/2023\\\/08\\\/TSEP-Logo_claim_primaer_pos.svg\",\"width\":482,\"height\":72,\"caption\":\"Technical Software Engineering Plazotta GmbH\"},\"image\":{\"@id\":\"https:\\\/\\\/tsep.com\\\/en\\\/#\\\/schema\\\/logo\\\/image\\\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/tsep.com\\\/en\\\/#\\\/schema\\\/person\\\/c4f48e026718a39d08b7d352475ead55\",\"name\":\"tsepthebusiness\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/ff4a94ae8934a6e5f5a19ea117ea51567bf303413b44dcfa1d970622c5667e48?s=96&d=mm&r=g\",\"url\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/ff4a94ae8934a6e5f5a19ea117ea51567bf303413b44dcfa1d970622c5667e48?s=96&d=mm&r=g\",\"contentUrl\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/ff4a94ae8934a6e5f5a19ea117ea51567bf303413b44dcfa1d970622c5667e48?s=96&d=mm&r=g\",\"caption\":\"tsepthebusiness\"},\"sameAs\":[\"https:\\\/\\\/tsep.com\"],\"url\":\"https:\\\/\\\/tsep.com\\\/en\\\/author\\\/tsepthebusiness\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"TSEP in the Trade Press: USBTMC's Challenges in Measurement Technology - Technical Software Engineering Plazotta GmbH","description":"PC&Industrie has published a technical article on the USB standard and the necessary modifications to existing USBTMC interface solutions for measuring instruments.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/tsep.com\/en\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\/","og_locale":"en_US","og_type":"article","og_title":"TSEP in the Trade Press: USBTMC's Challenges in Measurement Technology - Technical Software Engineering Plazotta GmbH","og_description":"PC&Industrie has published a technical article on the USB standard and the necessary modifications to existing USBTMC interface solutions for measuring instruments.","og_url":"https:\/\/tsep.com\/en\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\/","og_site_name":"Technical Software Engineering Plazotta GmbH","article_published_time":"2026-06-25T07:46:29+00:00","article_modified_time":"2026-10-28T14:00:34+00:00","og_image":[{"width":2560,"height":1706,"url":"https:\/\/tsep.com\/wp-content\/uploads\/2024\/10\/TSEP-2024-09-Stills-342_v1-print-e1772448940133.jpg","type":"image\/jpeg"}],"author":"tsepthebusiness","twitter_card":"summary_large_image","twitter_misc":{"Written by":"tsepthebusiness","Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/tsep.com\/en\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\/#article","isPartOf":{"@id":"https:\/\/tsep.com\/en\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\/"},"author":{"name":"tsepthebusiness","@id":"https:\/\/tsep.com\/en\/#\/schema\/person\/c4f48e026718a39d08b7d352475ead55"},"headline":"TSEP in the Trade Press: USBTMC&#8217;s Challenges in Measurement Technology","datePublished":"2026-06-25T07:46:29+00:00","dateModified":"2026-10-28T14:00:34+00:00","mainEntityOfPage":{"@id":"https:\/\/tsep.com\/en\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\/"},"wordCount":84,"publisher":{"@id":"https:\/\/tsep.com\/en\/#organization"},"image":{"@id":"https:\/\/tsep.com\/en\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\/#primaryimage"},"thumbnailUrl":"https:\/\/tsep.com\/wp-content\/uploads\/2024\/10\/TSEP-2024-09-Stills-342_v1-print-e1772448940133.jpg","articleSection":["Unkategorisiert"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/tsep.com\/en\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\/","url":"https:\/\/tsep.com\/en\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\/","name":"TSEP in the Trade Press: USBTMC's Challenges in Measurement Technology - Technical Software Engineering Plazotta GmbH","isPartOf":{"@id":"https:\/\/tsep.com\/en\/#website"},"primaryImageOfPage":{"@id":"https:\/\/tsep.com\/en\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\/#primaryimage"},"image":{"@id":"https:\/\/tsep.com\/en\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\/#primaryimage"},"thumbnailUrl":"https:\/\/tsep.com\/wp-content\/uploads\/2024\/10\/TSEP-2024-09-Stills-342_v1-print-e1772448940133.jpg","datePublished":"2026-06-25T07:46:29+00:00","dateModified":"2026-10-28T14:00:34+00:00","description":"PC&Industrie has published a technical article on the USB standard and the necessary modifications to existing USBTMC interface solutions for measuring instruments.","breadcrumb":{"@id":"https:\/\/tsep.com\/en\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/tsep.com\/en\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/tsep.com\/en\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\/#primaryimage","url":"https:\/\/tsep.com\/wp-content\/uploads\/2024\/10\/TSEP-2024-09-Stills-342_v1-print-e1772448940133.jpg","contentUrl":"https:\/\/tsep.com\/wp-content\/uploads\/2024\/10\/TSEP-2024-09-Stills-342_v1-print-e1772448940133.jpg","width":2560,"height":1706,"caption":"TSEP Themis"},{"@type":"BreadcrumbList","@id":"https:\/\/tsep.com\/en\/tsep-in-the-trade-press-usbtmcs-challenges-in-measurement-technology\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/tsep.com\/en\/"},{"@type":"ListItem","position":2,"name":"TSEP in the Trade Press: USBTMC&#8217;s Challenges in Measurement Technology"}]},{"@type":"WebSite","@id":"https:\/\/tsep.com\/en\/#website","url":"https:\/\/tsep.com\/en\/","name":"Technical Software Engineering Plazotta GmbH","description":"TSEP ist ein weltweites t\u00e4tiges Systemhaus, das sich seit \u00fcber 30 Jahren auf die Entwicklung systemnaher Software spezialisiert hat.","publisher":{"@id":"https:\/\/tsep.com\/en\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/tsep.com\/en\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/tsep.com\/en\/#organization","name":"Technical Software Engineering Plazotta GmbH","url":"https:\/\/tsep.com\/en\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/tsep.com\/en\/#\/schema\/logo\/image\/","url":"https:\/\/tsep.com\/wp-content\/uploads\/2023\/08\/TSEP-Logo_claim_primaer_pos.svg","contentUrl":"https:\/\/tsep.com\/wp-content\/uploads\/2023\/08\/TSEP-Logo_claim_primaer_pos.svg","width":482,"height":72,"caption":"Technical Software Engineering Plazotta GmbH"},"image":{"@id":"https:\/\/tsep.com\/en\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/tsep.com\/en\/#\/schema\/person\/c4f48e026718a39d08b7d352475ead55","name":"tsepthebusiness","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/secure.gravatar.com\/avatar\/ff4a94ae8934a6e5f5a19ea117ea51567bf303413b44dcfa1d970622c5667e48?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/ff4a94ae8934a6e5f5a19ea117ea51567bf303413b44dcfa1d970622c5667e48?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/ff4a94ae8934a6e5f5a19ea117ea51567bf303413b44dcfa1d970622c5667e48?s=96&d=mm&r=g","caption":"tsepthebusiness"},"sameAs":["https:\/\/tsep.com"],"url":"https:\/\/tsep.com\/en\/author\/tsepthebusiness\/"}]}},"_links":{"self":[{"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/posts\/139529","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/comments?post=139529"}],"version-history":[{"count":1,"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/posts\/139529\/revisions"}],"predecessor-version":[{"id":139530,"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/posts\/139529\/revisions\/139530"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/media\/11979"}],"wp:attachment":[{"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/media?parent=139529"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/categories?post=139529"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/tags?post=139529"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}