{"id":12989,"date":"2025-04-09T13:49:09","date_gmt":"2025-04-09T11:49:09","guid":{"rendered":"https:\/\/tsep.com\/sensortest-2025-visit-tsep\/"},"modified":"2025-04-10T11:14:59","modified_gmt":"2025-04-10T09:14:59","slug":"sensortest-2025-visit-tsep","status":"publish","type":"post","link":"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/","title":{"rendered":"SENSOR+TEST 2025 – VISIT TSEP"},"content":{"rendered":"\n

TSEP will be exhibiting at Sensor+Test 2025<\/a> from 6 – 8 May, 2025 in Nuremberg in Hall 1, Booth 1-345. <\/strong><\/p>\n\n\n\n

At the trade fair, we will be presenting the latest generation of TSEP THEMIS, the modular and flexible T&M system. <\/strong>The measuring devices enable extremely agile and efficient development and optimization of test and measurement tasks. They allow individual measurement problems to be implemented quickly and flexibly using standard components and offer a proven measurement framework. <\/p>\n\n\n\n

Trigger&Sync solution for IEEE 1588 synchronization<\/mark><\/strong><\/h4>\n\n\n\n

To enable the time synchronization of measuring devices from different manufacturers – especially via IEEE 1588 – and the configuration of the associated time-dependent triggers, TSEP has developed a comprehensive product as part of the further development of the IVI specification:
This product coordinates the time synchronization – via the time synchronization protocols IEEE 1588 PTP or TSEP Athena<\/strong> – both between several TSEP THEMIS devices and between different plug-in cards within a single THEMIS device. It also handles the central configuration, management and control of the entire system as a single unit. <\/p>\n\n\n\n

Adapter for USB-TMC connection<\/strong><\/h4>\n\n\n\n

TSEP has developed an adapter that turns any conventional USB port (USB 3.0) into a USB-TMC port – and thus also enables USB-TMC for smaller measuring device manufacturers. The adapter can be installed directly in the device or used as an external adapter.
The TSEP remote system Poseidon<\/strong> natively supports this adapter and thus provides a USB-TMC communication channel. There is also native support for the client side of IVI and various Visa implementations (NI, Keysight, R&S). For manufacturers with their own SCPI remote system, TSEP offers a corresponding software package (Windows\/Linux\/RTOS) to support this interface. <\/p>\n\n\n\n

Visit us at our booth<\/h3>\n\n\n\n

Our team is looking forward to meeting all visitors at our booth at Sensor+Test 2025.
To coordinate appointments, simply send a short registration e-mail to<\/strong> info@tsep.com<\/a>.<\/p>\n\n\n\n

\"\"<\/figure>\n","protected":false},"excerpt":{"rendered":"

TSEP will be exhibiting at Sensor+Test 2025 from 6 – 8 May, 2025 in Nuremberg in Hall 1, Booth 1-345. At the trade fair, we will be presenting the latest generation of TSEP THEMIS, the modular and flexible T&M system. The measuring devices enable extremely agile and efficient development and optimization of test and measurement […]<\/p>\n","protected":false},"author":3,"featured_media":12979,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[30,1],"tags":[],"class_list":["post-12989","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-press-releases-en","category-unkategorisiert"],"acf":[],"yoast_head":"\nSENSOR+TEST 2025 - VISIT TSEP - Technical Software Engineering Plazotta GmbH<\/title>\n<meta name=\"description\" content=\"TSEP presents the latest generation of TSEP THEMIS, the modular and flexible T&M system, at Sensor+Test 2025 (6 - 8 May, 2025 in Nuremberg) in Hall 1, booth 1-345. New: A Trigger&Sync solution for IEEE 1588 synchronization and an adapter for the USB-TMC connection.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"SENSOR+TEST 2025 - VISIT TSEP - Technical Software Engineering Plazotta GmbH\" \/>\n<meta property=\"og:description\" content=\"TSEP presents the latest generation of TSEP THEMIS, the modular and flexible T&M system, at Sensor+Test 2025 (6 - 8 May, 2025 in Nuremberg) in Hall 1, booth 1-345. New: A Trigger&Sync solution for IEEE 1588 synchronization and an adapter for the USB-TMC connection.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/\" \/>\n<meta property=\"og:site_name\" content=\"Technical Software Engineering Plazotta GmbH\" \/>\n<meta property=\"article:published_time\" content=\"2025-04-09T11:49:09+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2025-04-10T09:14:59+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/tsep.com\/wp-content\/uploads\/2025\/04\/TSEP-SensorTest25-Website-1.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1366\" \/>\n\t<meta property=\"og:image:height\" content=\"768\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"tsepthebusiness\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"tsepthebusiness\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/\"},\"author\":{\"name\":\"tsepthebusiness\",\"@id\":\"https:\/\/tsep.com\/en\/#\/schema\/person\/c4f48e026718a39d08b7d352475ead55\"},\"headline\":\"SENSOR+TEST 2025 – VISIT TSEP\",\"datePublished\":\"2025-04-09T11:49:09+00:00\",\"dateModified\":\"2025-04-10T09:14:59+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/\"},\"wordCount\":313,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\/\/tsep.com\/en\/#organization\"},\"image\":{\"@id\":\"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/tsep.com\/wp-content\/uploads\/2025\/04\/TSEP-SensorTest25-Website-1.jpg\",\"articleSection\":[\"Press releases\",\"Unkategorisiert\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/\",\"url\":\"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/\",\"name\":\"SENSOR+TEST 2025 - VISIT TSEP - Technical Software Engineering Plazotta GmbH\",\"isPartOf\":{\"@id\":\"https:\/\/tsep.com\/en\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/tsep.com\/wp-content\/uploads\/2025\/04\/TSEP-SensorTest25-Website-1.jpg\",\"datePublished\":\"2025-04-09T11:49:09+00:00\",\"dateModified\":\"2025-04-10T09:14:59+00:00\",\"description\":\"TSEP presents the latest generation of TSEP THEMIS, the modular and flexible T&M system, at Sensor+Test 2025 (6 - 8 May, 2025 in Nuremberg) in Hall 1, booth 1-345. New: A Trigger&Sync solution for IEEE 1588 synchronization and an adapter for the USB-TMC connection.\",\"breadcrumb\":{\"@id\":\"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/#primaryimage\",\"url\":\"https:\/\/tsep.com\/wp-content\/uploads\/2025\/04\/TSEP-SensorTest25-Website-1.jpg\",\"contentUrl\":\"https:\/\/tsep.com\/wp-content\/uploads\/2025\/04\/TSEP-SensorTest25-Website-1.jpg\",\"width\":1366,\"height\":768,\"caption\":\"Sensor+Test 2025\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/tsep.com\/en\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"SENSOR+TEST 2025 – VISIT TSEP\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/tsep.com\/en\/#website\",\"url\":\"https:\/\/tsep.com\/en\/\",\"name\":\"Technical Software Engineering Plazotta GmbH\",\"description\":\"TSEP ist ein weltweites t\u00e4tiges Systemhaus, das sich seit \u00fcber 30 Jahren auf die Entwicklung systemnaher Software spezialisiert hat.\",\"publisher\":{\"@id\":\"https:\/\/tsep.com\/en\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/tsep.com\/en\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/tsep.com\/en\/#organization\",\"name\":\"Technical Software Engineering Plazotta GmbH\",\"url\":\"https:\/\/tsep.com\/en\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/tsep.com\/en\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/tsep.com\/wp-content\/uploads\/2023\/08\/TSEP-Logo_claim_primaer_pos.svg\",\"contentUrl\":\"https:\/\/tsep.com\/wp-content\/uploads\/2023\/08\/TSEP-Logo_claim_primaer_pos.svg\",\"width\":482,\"height\":72,\"caption\":\"Technical Software Engineering Plazotta GmbH\"},\"image\":{\"@id\":\"https:\/\/tsep.com\/en\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/tsep.com\/en\/#\/schema\/person\/c4f48e026718a39d08b7d352475ead55\",\"name\":\"tsepthebusiness\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/tsep.com\/en\/#\/schema\/person\/image\/\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/ff4a94ae8934a6e5f5a19ea117ea51567bf303413b44dcfa1d970622c5667e48?s=96&d=mm&r=g\",\"contentUrl\":\"https:\/\/secure.gravatar.com\/avatar\/ff4a94ae8934a6e5f5a19ea117ea51567bf303413b44dcfa1d970622c5667e48?s=96&d=mm&r=g\",\"caption\":\"tsepthebusiness\"},\"sameAs\":[\"https:\/\/tsep.com\"],\"url\":\"https:\/\/tsep.com\/en\/author\/tsepthebusiness\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"SENSOR+TEST 2025 - VISIT TSEP - Technical Software Engineering Plazotta GmbH","description":"TSEP presents the latest generation of TSEP THEMIS, the modular and flexible T&M system, at Sensor+Test 2025 (6 - 8 May, 2025 in Nuremberg) in Hall 1, booth 1-345. New: A Trigger&Sync solution for IEEE 1588 synchronization and an adapter for the USB-TMC connection.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/","og_locale":"en_US","og_type":"article","og_title":"SENSOR+TEST 2025 - VISIT TSEP - Technical Software Engineering Plazotta GmbH","og_description":"TSEP presents the latest generation of TSEP THEMIS, the modular and flexible T&M system, at Sensor+Test 2025 (6 - 8 May, 2025 in Nuremberg) in Hall 1, booth 1-345. New: A Trigger&Sync solution for IEEE 1588 synchronization and an adapter for the USB-TMC connection.","og_url":"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/","og_site_name":"Technical Software Engineering Plazotta GmbH","article_published_time":"2025-04-09T11:49:09+00:00","article_modified_time":"2025-04-10T09:14:59+00:00","og_image":[{"width":1366,"height":768,"url":"https:\/\/tsep.com\/wp-content\/uploads\/2025\/04\/TSEP-SensorTest25-Website-1.jpg","type":"image\/jpeg"}],"author":"tsepthebusiness","twitter_card":"summary_large_image","twitter_misc":{"Written by":"tsepthebusiness","Est. reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/#article","isPartOf":{"@id":"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/"},"author":{"name":"tsepthebusiness","@id":"https:\/\/tsep.com\/en\/#\/schema\/person\/c4f48e026718a39d08b7d352475ead55"},"headline":"SENSOR+TEST 2025 – VISIT TSEP","datePublished":"2025-04-09T11:49:09+00:00","dateModified":"2025-04-10T09:14:59+00:00","mainEntityOfPage":{"@id":"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/"},"wordCount":313,"commentCount":0,"publisher":{"@id":"https:\/\/tsep.com\/en\/#organization"},"image":{"@id":"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/#primaryimage"},"thumbnailUrl":"https:\/\/tsep.com\/wp-content\/uploads\/2025\/04\/TSEP-SensorTest25-Website-1.jpg","articleSection":["Press releases","Unkategorisiert"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/","url":"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/","name":"SENSOR+TEST 2025 - VISIT TSEP - Technical Software Engineering Plazotta GmbH","isPartOf":{"@id":"https:\/\/tsep.com\/en\/#website"},"primaryImageOfPage":{"@id":"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/#primaryimage"},"image":{"@id":"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/#primaryimage"},"thumbnailUrl":"https:\/\/tsep.com\/wp-content\/uploads\/2025\/04\/TSEP-SensorTest25-Website-1.jpg","datePublished":"2025-04-09T11:49:09+00:00","dateModified":"2025-04-10T09:14:59+00:00","description":"TSEP presents the latest generation of TSEP THEMIS, the modular and flexible T&M system, at Sensor+Test 2025 (6 - 8 May, 2025 in Nuremberg) in Hall 1, booth 1-345. New: A Trigger&Sync solution for IEEE 1588 synchronization and an adapter for the USB-TMC connection.","breadcrumb":{"@id":"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/#primaryimage","url":"https:\/\/tsep.com\/wp-content\/uploads\/2025\/04\/TSEP-SensorTest25-Website-1.jpg","contentUrl":"https:\/\/tsep.com\/wp-content\/uploads\/2025\/04\/TSEP-SensorTest25-Website-1.jpg","width":1366,"height":768,"caption":"Sensor+Test 2025"},{"@type":"BreadcrumbList","@id":"https:\/\/tsep.com\/en\/sensortest-2025-visit-tsep\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/tsep.com\/en\/"},{"@type":"ListItem","position":2,"name":"SENSOR+TEST 2025 – VISIT TSEP"}]},{"@type":"WebSite","@id":"https:\/\/tsep.com\/en\/#website","url":"https:\/\/tsep.com\/en\/","name":"Technical Software Engineering Plazotta GmbH","description":"TSEP ist ein weltweites t\u00e4tiges Systemhaus, das sich seit \u00fcber 30 Jahren auf die Entwicklung systemnaher Software spezialisiert hat.","publisher":{"@id":"https:\/\/tsep.com\/en\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/tsep.com\/en\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/tsep.com\/en\/#organization","name":"Technical Software Engineering Plazotta GmbH","url":"https:\/\/tsep.com\/en\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/tsep.com\/en\/#\/schema\/logo\/image\/","url":"https:\/\/tsep.com\/wp-content\/uploads\/2023\/08\/TSEP-Logo_claim_primaer_pos.svg","contentUrl":"https:\/\/tsep.com\/wp-content\/uploads\/2023\/08\/TSEP-Logo_claim_primaer_pos.svg","width":482,"height":72,"caption":"Technical Software Engineering Plazotta GmbH"},"image":{"@id":"https:\/\/tsep.com\/en\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/tsep.com\/en\/#\/schema\/person\/c4f48e026718a39d08b7d352475ead55","name":"tsepthebusiness","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/tsep.com\/en\/#\/schema\/person\/image\/","url":"https:\/\/secure.gravatar.com\/avatar\/ff4a94ae8934a6e5f5a19ea117ea51567bf303413b44dcfa1d970622c5667e48?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/ff4a94ae8934a6e5f5a19ea117ea51567bf303413b44dcfa1d970622c5667e48?s=96&d=mm&r=g","caption":"tsepthebusiness"},"sameAs":["https:\/\/tsep.com"],"url":"https:\/\/tsep.com\/en\/author\/tsepthebusiness\/"}]}},"_links":{"self":[{"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/posts\/12989","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/comments?post=12989"}],"version-history":[{"count":0,"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/posts\/12989\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/media\/12979"}],"wp:attachment":[{"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/media?parent=12989"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/categories?post=12989"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/tsep.com\/en\/wp-json\/wp\/v2\/tags?post=12989"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}