TSEP at the Embedded World 2017

10 April 2017 | Fair

Big, bigger, Embedded World!

With its 15th edition, Embedded World once again impressively confirms that it is the international meeting place for the embedded system technology industry. More than 30,000 trade visitors came to Nürnberg and with more than 1,000 exhibitors from 40 countries, the event set a new highlight.

TSEP presented itself for the first time at the Embedded World!

We would like to thank you very much for visiting our booth. We hope that the fair was as interesting and informative for you as it was for us as a first-time exhibitor. Thank you very much for your interest in our offer, in our services and in many cases also for your trust!

At the TSEP-Microsoft joint booth, national and international visitors experienced the wide range of services offered by TSEP.

TSEP reported on the first day of the trade fair congress on the subject of LXI and IEEE 1588 and on the latest possibilities of IEEE 1588 (PTP time synchronization) with LXI standard and the Intel I21x and I350 network chip.

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